1 multilayer organic (mlo tm ) 0806 cdma diplexer mlo tm technology the 0806 diplexer is a best in class low profile multilayer organic passive device that is based on avx?s patented multilayer organic high density interconnect technology. the mlo tm diplexer uses high dielectric constant and low loss materials to realize high q passive printed passive elements such as inductors and capacitors in a multilayer stack up. the mlo tm diplexers can support multiple wireless standards such as wcdma, cdma, wlan, and gsm and are less than 0.6mm in thickness. these components are ideally suited for band switching for dual band systems. all diplexers are expansion matched to fr4 thereby resulting in improved reliability over standard si and ceramic devices. quality inspection finished parts are 100% tested for electrical parameters and visual characteristics. operating temperature -40oc to +85oc termination finishes available in ni/sn, immersion sn, immersion au and osp coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. 0806 cdma diplexer specifications part number: DP06B1945TTR b design 1945 frequency (mhz) 7 finish 7 = au t = nisn tr packaging tape & reel how to order dp type 06 size bottom view side view 0.2540.05 (0.0100.002) 0.1910.10 (0.0080.004) 2.2230.20 (0.0880.008) 0.4450.10 (0.0180.004) 0.550.10 (0.0220.004) 0.6350.05 (0.0250.002) 0.1270.04 (0.0050.002) 0.2540.10 (0.0100.004) 1.4610.10 (0.0580.004) 0.9530.05 (0.0380.002) unit: mm (inches) orientation in tape 16 25 34 16 25 34 16 25 34 component dimensions and functions terminal no. terminal name 1 low frequency port 2g n d 3 high frequency port 4g n d 5 common port 6g n d power capacity 4.5w maximum applications multiband applications including wcdma, wlan, wimax, gps, and cellular bands l and g rid a rray advantages ? low insertion loss ? excellent solderability ? low parasitics ? low pr ofile specification avx -mlo tm mm (inches) size 2.2 x 1.5 (0.083 x 0.060) height 0.55 (0.021) volume (mm^3) 1.75 frequency range (f1) (mhz) 730 230 mhz frequency range (f2) (mhz) 2200 500 mhz insertion loss (f1, at fc @ 25 o c) -0.4 insertion loss (f1 at fc) (-40 to 85oc) - 0.55 insertion loss (f2, at fc @ 25oc) -0.5 insertion loss (f1 at fc ) (-40 to 85oc) -0.65 attenuation (f1) at (f2) (db min) -22 attenuation (f2) at (f1) (db min) -22 vswr (input @ f1) 1.2 vswr (input @ f2) 1.6 vswr (lowband @ f1) 1.3 vswr (highband @ f2) 1.7
2 multilayer organic (mlo tm ) 0806 cdma diplexer 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.5 1.3 -2.5 -2.0 -1.5 -1.0 -0.5 -3.0 0.0 frequency (ghz) insertion loss (db) 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 1.2 3.0 -2.5 -2.0 -1.5 -1.0 -0.5 -3.0 0.0 frequency (ghz) insertion loss (db) frequency (ghz) insertion loss (db) 0.500 0.121 0.698 0.199 0.960 0.400 frequency (ghz) insertion loss (db) 1.710 0.430 2.180 0.352 2.700 0.360 low band insertion loss high band insertion loss attenuation 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 0.4 3.0 -40 -30 -20 -10 -50 0 frequency (ghz) attenuation (db) 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 0.4 3.0 -40 -30 -20 -10 -50 0 frequency (ghz) attenuation (db) frequency (ghz) attenuation (db) 1.710 26.726 2.180 24.681 2.700 31.074 frequency (ghz) attenuation (db) 0.500 26.671 0.698 28.611 0.960 23.988 low band attenaution high band attenaution s parameter measurements insertion loss
3 frequency (ghz) insertion loss (db) 0.500 29.191 0.698 23.723 0.960 17.655 frequency (ghz) insertion loss (db) 1.710 18.487 2.180 15.685 2.700 17.037 low band return loss high band return loss frequency (ghz) attenuation (db) 0.500 32.382 0.698 27.566 0.960 19.543 1.710 23.343 2.180 17.958 2.700 16.744 frequency (ghz) attenuation (db) 0.500 26.956 0.698 28.872 0.960 24.238 1.710 35.833 2.180 26.827 2.700 29.338 common port return loss isolation multilayer organic (mlo tm ) 0806 cdma diplexer return loss 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 0.4 3.0 -25 -20 -15 -10 -5 -30 0 frequency (ghz) return loss (db) 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 0.4 3.0 -20 -15 -10 -5 -25 0 frequency (ghz) return loss (db) isolation common return loss 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 0.4 3.0 -30 -25 -20 -15 -10 -5 -35 0 frequency (ghz) return loss (db) 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 0.4 3.0 -35 -30 -25 -20 -15 -10 -5 -40 0 frequency (ghz) isolation (db)
4 multilayer organic (mlo tm ) 0806 cdma diplexer automated smt assembly smt reflow profile the following section describes the guidelines for automated smt assembly of mlo tm rf devices which are typically land grid array (lga) packages or side termination smt pacages. control of solder and solder paste volume is critical for surface mount assembly of mlo tm rf devices onto the pcb. stencil thickness and aperture openings should be adjusted according to the optimal solder volume. the following are general recommendations for smt mounting of mlo tm devices onto the pcb. common ir or convection reflow smt processes shall be used for the assembly. standard smt reflow profiles, for eutectic and pb free solders, can be used to surface mount the mlo tm devices onto the pcb. in all cases, a temperature gradient of 3c/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. additional soak time and slower preheating time may be required to improve the out-gassing of solder paste. in addition, the reflow profile depends on the pcb density and the type of solder paste used. standard no-clean solder paste is generally recommended. if another type of flux is used, complete removal of flux residual may be necessary. example of a typical lead free reflow profile is shown below. profile parameter pb free, convection, ir/convection ramp-up rate (tsmax to tp 3oc/second max. preheat temperature (ts min to ts max) 150oc to 200oc preheat time (ts) 60 ? 180 seconds time above t l , 217oc (t l ) 60 ? 120 seconds peak temperature (tp) 260c time within 5oc of peak temperature (tp) 10 ? 20 seconds ramp-down rate 4oc/second max. time 25oc to peak temperature 6 minutes max. critical zone t l to tp ramp-down ramp-up ts max 25 t 25? to peak ts min ts preheat tp tp t l t l time temperature figure a. typical lead free profile and parameters
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